Rochester Electronics CD4014BMJ/883C

表面安装

NO

终端数量

16

RoHS

有

Risk Rank

5.87

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Part Life Cycle Code

Obsolete

Manufacturer

National Semiconductor Corporation

Package Shape

RECTANGULAR

Package Code

DIP

Manufacturer Part Number

CD4014BMJ/883C

Rohs Code

无

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Equivalence Code

DIP16,.3

Package Body Material

CERAMIC

Package Style

IN-LINE

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

移位寄存器

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

compliant

JESD-30代码

R-XDIP-T16

资历状况

不合格

电源

5/15 V

温度等级

MILITARY

比特数

8

筛选水平

MIL-STD-883 Class C

计数方向

RIGHT