Rochester Electronics CDP1824CD/3
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CDP1824CD/3
2071-CDP1824CD/3
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CDP1824CD/3 datasheet pdf and Integrated Circuits (ICs) product details from Rochester Electronics stock available at utmel
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CDP1824CD/3详情
Rochester Electronics CDP1824CD/3重要参数规格及、参数值,及相似型号如下:
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表面安装
NO
终端数量
18
Manufacturer Part Number
CDP1824CD/3
Rohs Code
无
Part Life Cycle Code
Obsolete
Ihs Manufacturer
RCA SOLID STATE
Package Description
DIP, DIP18,.3
Risk Rank
5.89
Number of Words
32 words
Number of Words Code
32
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
CERAMIC
Package Code
DIP
Package Equivalence Code
DIP18,.3
Package Shape
RECTANGULAR
Package Style
IN-LINE
Supply Voltage-Nom (Vsup)
5 V
Usage Level
Military grade
JESD-609代码
e0
端子表面处理
Tin/Lead (Sn/Pb)
端子位置
DUAL
终端形式
THROUGH-HOLE
端子间距
2.54 mm
Reach合规守则
unknown
JESD-30代码
R-XDIP-T18
资历状况
不合格
电源
5 V
温度等级
INDUSTRIAL
操作模式
ASYNCHRONOUS
组织结构
32X8
输出特性
3-STATE
内存宽度
8
筛选水平
MIL-STD-883 Class B (Modified)
并行/串行
PARALLEL
内存IC类型
标准SRAM
CDP1824CD/3拓展信息
Rochester Electronics
Rochester Electronics
Rochester Electronics
Rochester Electronics
Rochester Electronics
Rochester Electronics
Rochester Electronics
Rochester Electronics
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