Rochester Electronics ICM7170AMDG

表面安装

NO

终端数量

24

Package Description

DIP,

Package Style

IN-LINE

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Operating Temperature-Min

-55 °C

Reflow Temperature-Max (s)

未说明

Operating Temperature-Max

125 °C

Rohs Code

有

Manufacturer Part Number

ICM7170AMDG

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

接触制造商

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Risk Rank

5.16

Part Package Code

DIP

无铅代码

有

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

峰值回流焊温度（摄氏度）

未说明

Reach合规守则

unknown

引脚数量

24

JESD-30代码

R-CDIP-T24

温度等级

MILITARY

uPs/uCs/外围ICs类型

TIMER, REAL TIME CLOCK

外部数据总线宽度

8

信息访问方法

PARALLEL, DIRECT ADDRESS/MUXED BUS