Rochester Electronics IM6653MJG

表面安装

NO

终端数量

24

Package Description

DIP, DIP24,.6

Package Style

IN-LINE

Number of Words Code

1000

Package Body Material

CERAMIC

Package Equivalence Code

DIP24,.6

Operating Temperature-Min

-55 °C

Access Time-Max

600 ns

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

IM6653MJG

Number of Words

1024 words

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

General Electric Solid State

Part Life Cycle Code

Transferred

Ihs Manufacturer

GENERAL ELECTRIC SOLID STATE

Risk Rank

5.77

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

其他存储器集成电路

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T24

资历状况

不合格

温度等级

MILITARY

电源电流-最大值

0.006 mA

组织结构

1KX4

输出特性

3-STATE

内存宽度

4

待机电流-最大值

0.00004 A

记忆密度

4096 bit

I/O类型

COMMON

内存IC类型

OTP ROM