Rochester Electronics M38510/00803BDX
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M38510/00803BDX
2071-M38510/00803BDX
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M38510/00803BDX datasheet pdf and Integrated Circuits (ICs) product details from Rochester Electronics stock available at utmel
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M38510/00803BDX详情
Rochester Electronics M38510/00803BDX重要参数规格及、参数值,及相似型号如下:
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- 参数名参数值全选
表面安装
YES
终端数量
14
Manufacturer Part Number
M38510/00803BDX
Part Life Cycle Code
活跃
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
Risk Rank
5.49
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
DFP
Package Shape
RECTANGULAR
Package Style
FLATPACK
Supply Voltage-Nom (Vsup)
5 V
Reflow Temperature-Max (s)
NOT APPLICABLE
HTS代码
8542.39.00.01
端子位置
DUAL
终端形式
FLAT
峰值回流焊温度(摄氏度)
NOT APPLICABLE
功能数量
6
端子间距
1.27 mm
Reach合规守则
unknown
JESD-30代码
R-GDFP-F14
资历状况
Qualified
电源电压-最大值(Vsup)
5.5 V
温度等级
MILITARY
电源电压-最小值(Vsup)
4.5 V
家人
TTL/H/L
输入数量
1
输出特性
OPEN-COLLECTOR
座位高度-最大
2.03 mm
逻辑IC类型
BUFFER
传播延迟(tpd)
30 ns
长度
9.21 mm
宽度
6.29 mm
M38510/00803BDX拓展信息
Rochester Electronics
Rochester Electronics
Rochester Electronics
Rochester Electronics
Rochester Electronics
Rochester Electronics
Rochester Electronics
Rochester Electronics
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