Rochester Electronics M38510/06003BFA
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M38510/06003BFA
2071-M38510/06003BFA
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M38510/06003BFA datasheet pdf and Integrated Circuits (ICs) product details from Rochester Electronics stock available at utmel
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M38510/06003BFA详情
Rochester Electronics M38510/06003BFA重要参数规格及、参数值,及相似型号如下:
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- 参数名参数值全选
表面安装
YES
终端数量
16
Manufacturer Part Number
M38510/06003BFA
Rohs Code
无
Part Life Cycle Code
Obsolete
Ihs Manufacturer
MOTOROLA INC
Package Description
DFP,
Risk Rank
5.47
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
DFP
Package Shape
RECTANGULAR
Package Style
FLATPACK
Reflow Temperature-Max (s)
未说明
Usage Level
Military grade
JESD-609代码
e0
端子表面处理
Tin/Lead (Sn/Pb)
HTS代码
8542.39.00.01
端子位置
DUAL
终端形式
FLAT
峰值回流焊温度(摄氏度)
未说明
功能数量
3
Reach合规守则
unknown
JESD-30代码
R-GDFP-F16
资历状况
不合格
温度等级
MILITARY
家人
10K
输入数量
3
逻辑IC类型
OR/NOR GATE
筛选水平
MIL-M-38510 Class B
传播延迟(tpd)
3.7 ns
M38510/06003BFA拓展信息
Rochester Electronics
Rochester Electronics
Rochester Electronics
Rochester Electronics
Rochester Electronics
Rochester Electronics
Rochester Electronics
Rochester Electronics
Rochester Electronics
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