Rochester Electronics M38510/75002BDA

表面安装

YES

终端数量

14

EU RoHS

不合规

ECCN (US)

EAR99

HTS

8542330001

Automotive

无

PPAP

无

Mounting

表面贴装

Package Height

2.03(Max)

Package Width

6.6(Max)

Package Length

9.91(Max)

PCB changed

14

Standard Package Name

FPAK

Supplier Package

CFPAK

Lead Shape

Flat

Package Description

CERAMIC, DFP-14

Package Style

FLATPACK

Load Capacitance (CL)

50 pF

Package Body Material

CERAMIC, GLASS-SEALED

Package Equivalence Code

FL14,.3

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Manufacturer Part Number

M38510/75002BDA

Supply Voltage-Nom (Vsup)

4.5 V

Package Code

DFP

Package Shape

RECTANGULAR

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Risk Rank

5.25

Part Package Code

DFP

Prop.

12 ns

Usage Level

Military grade

JESD-609代码

e0

零件状态

活跃

端子表面处理

锡铅

HTS代码

8542.39.00.01

子类别

Gate

技术

CMOS

端子位置

DUAL

终端形式

FLAT

功能数量

3

端子间距

1.27 mm

Reach合规守则

unknown

引脚数量

14

JESD-30代码

R-GDFP-F14

资历状况

Qualified

电源电压-最大值(Vsup)

5.5 V

电源

3.3/5 V

温度等级

MILITARY

电源电压-最小值(Vsup)

3 V

家人

AC

输入数量

3

逻辑IC类型

NAND GATE

最大 I(ol)

0.012 A

筛选水平

MIL-PRF-38535 Class B

传播延迟(tpd)

12 ns

施密特触发器

NO