Rochester Electronics MM54C150J

表面安装

NO

终端数量

24

Package Description

DIP, DIP24,.6

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP24,.6

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

MM54C150J

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Fairchild Semiconductor Corporation

Part Life Cycle Code

Transferred

Ihs Manufacturer

FAIRCHILD SEMICONDUCTOR CORP

Risk Rank

5.86

Prop.

600 ns

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Multiplexer/Demultiplexers

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T24

资历状况

不合格

电源

5/15 V

温度等级

MILITARY

输入数量

16

逻辑IC类型

MULTIPLEXER

最大 I(ol)

0.0016 A

电源电流-最大值(ICC)

0.3 mA