Rochester Electronics MM54C89J

表面安装

NO

终端数量

16

Package

Bulk

厂商

Rochester Electronics, LLC

Product Status

活跃

Package Description

DIP,

Package Style

IN-LINE

Number of Words Code

16

Package Body Material

CERAMIC, GLASS-SEALED

Operating Temperature-Min

-55 °C

Access Time-Max

910 ns

Operating Temperature-Max

125 °C

Manufacturer Part Number

MM54C89J

Number of Words

16 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Risk Rank

5.75

系列

*

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-GDIP-T16

电源电压-最大值(Vsup)

15 V

温度等级

MILITARY

电源电压-最小值(Vsup)

3 V

操作模式

ASYNCHRONOUS

组织结构

16X4

座位高度-最大

5.08 mm

内存宽度

4

记忆密度

64 bit

并行/串行

PARALLEL

内存IC类型

标准SRAM

宽度

7.62 mm

长度

19.43 mm