Rochester Electronics MM54HC259J/883

表面安装

NO

终端数量

16

Factory Pack QuantityFactory Pack Quantity

1000

Manufacturer

TE Connectivity

Brand

TE Connectivity

Package Description

DIP,

Package Style

IN-LINE

Package Body Material

CERAMIC, GLASS-SEALED

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Manufacturer Part Number

MM54HC259J/883

Supply Voltage-Nom (Vsup)

4.5 V

Package Code

DIP

Package Shape

RECTANGULAR

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Risk Rank

5.69

Usage Level

Military grade

附加功能

1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH

HTS代码

8542.39.00.01

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-GDIP-T16

电源电压-最大值(Vsup)

6 V

温度等级

MILITARY

电源电压-最小值(Vsup)

2 V

比特数

8

家人

HC/UH

座位高度-最大

5.08 mm

输出极性

TRUE

逻辑IC类型

D 拉锁

筛选水平

MIL-STD-883

触发器类型

低电平

传播延迟(tpd)

250 ns

产品类别

TE Connectivity

宽度

7.62 mm

长度

19.304 mm