Rochester Electronics MM54HC30J/883

表面安装

NO

终端数量

14

Package

Bulk

厂商

PEI-Genesis

Product Status

活跃

Package Description

DIP,

Package Style

IN-LINE

Package Body Material

CERAMIC, GLASS-SEALED

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Manufacturer Part Number

MM54HC30J/883

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Risk Rank

5.69

Usage Level

Military grade

系列

*

HTS代码

8542.39.00.01

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-GDIP-T14

电源电压-最大值(Vsup)

6 V

温度等级

MILITARY

电源电压-最小值(Vsup)

2 V

家人

HC/UH

输入数量

8

座位高度-最大

5.08 mm

逻辑IC类型

NAND GATE

筛选水平

MIL-STD-883

传播延迟(tpd)

49 ns

宽度

7.62 mm

长度

19.43 mm