Rochester Electronics MR8254

表面安装

YES

终端数量

28

Package Description

QCCN, LCC28,.45SQ

Package Style

CHIP CARRIER

Package Body Material

CERAMIC

Package Equivalence Code

LCC28,.45SQ

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

MR8254

Supply Voltage-Nom (Vsup)

5 V

Package Code

QCCN

Package Shape

SQUARE

Manufacturer

Intel Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Risk Rank

5.92

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

模拟波形生成功能

技术

MOS

端子位置

QUAD

终端形式

无铅

端子间距

1.27 mm

Reach合规守则

compliant

JESD-30代码

S-XQCC-N28

资历状况

不合格

电源

5 V

温度等级

MILITARY

筛选水平

38535Q/M;38534H;883B