Rochester Electronics LLC FPF2104

表面安装

YES

材料

polyolefin

终端数量

5

Type of capacitor

ceramic

Kind of capacitor

MLCC

Mounting

SMD

Case - inch

1206

Case - mm

3216

Capacitors series

KGM

Diameter before shrinking

35 mm

Diameter after shrinking

12 mm

Shrinking temperature

100 degrees C

Gross weight

3120.00

Transport packaging size/quantity

38*37*57/10

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Part Package Code

SOIC

Package Description

1.60 MM, MO-178AA, SOT-23, 5 PIN

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LSSOP

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Supply Voltage-Max

5.5 V

Supply Voltage-Min

1.8 V

Supply Voltage-Nom

3.3 V

Operating temperature

-55...125°C

包装

spool 25 m

容差

±5%

JESD-609代码

e3

无铅代码

有

类型

Heat shrink tube with adhesive layer

端子表面处理

哑光锡

颜色

black

电容量

4.7nF

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

功能数量

1

端子间距

0.95 mm

Reach合规守则

unknown

时间@峰值回流温度-最大值(s)

30

引脚数量

5

JESD-30代码

R-PDSO-G5

资历状况

COMMERCIAL

电介质

X7R

温度等级

INDUSTRIAL

座位高度-最大

1.4 mm

Operating temperature range

-55…+125 degrees C

接口IC类型

基于缓冲器或反相器的外设驱动器

输出峰值电流限制-名

0.6 A

内置保护器

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

输出电流流向

SOURCE

饱和电流

1

Operating voltage

≤1500 V

Shrink ratio

3 : 1

长度

2.9 mm

宽度

1.6 mm