Rochester Electronics LLC NC7SZ11P6X

表面安装

YES

材料

ABC plastic

终端数量

6

Center distance

167.5 mm

Gross weight

53.80

Transport packaging size/quantity

60*32*25/250

Features of semiconductor devices

glass passivated

Related items

B5X8/BN1719

Kind of package

bulk

Mechanical mounting

screw

Case

PWS-D flat

Leads

M5 screws

Max. forward voltage

1.3V

Version

module - slim

Electrical mounting

screw

Max. forward impulse current

0.9kA

Max. off-state voltage

1.8kV

Type of bridge rectifier

three-phase

Supply Voltage-Nom (Vsup)

1.8 V

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Package Shape

RECTANGULAR

Package Code

TSSOP

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Package Description

TSSOP,

Part Package Code

SOIC

Ihs Manufacturer

ROCHESTER ELECTRONICS INC

Part Life Cycle Code

活跃

Rohs Code

有

JESD-609代码

e3

无铅代码

有

类型

grille fan series KPG 200 x 200

端子表面处理

哑光锡

颜色

black

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

功能数量

1

端子间距

0.65 mm

Reach合规守则

unknown

时间@峰值回流温度-最大值(s)

30

引脚数量

6

JESD-30代码

R-PDSO-G6

资历状况

COMMERCIAL

电源电压-最大值(Vsup)

5.5 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

1.65 V

家人

LVC/LCX/Z

输入数量

3

座位高度-最大

1.1 mm

Hole diameter

fastening hole - 5.0

逻辑IC类型

AND GATE

传播延迟(tpd)

19 ns

Load current

75A

数量

internal rings - 5

饱和电流

1

高度

207 mm

宽度

207 mm

长度

2 mm