Rochester Electronics LLC SN54HC00J

表面安装

NO

材料

synthetic polyolefin

终端数量

14

Rohs Code

无

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Part Package Code

DIP

Package Description

HERMETIC SEALED, CERAMIC, DIP-14

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC, GLASS-SEALED

Package Code

DIP

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom (Vsup)

5 V

Diameter of protected wire (cable)

45…75 mm

Diameter before shrinkage

80 mm

Diameter after shrinkage

41.0 mm

Wall thickness before shrinkage

0.7 mm

Wall thickness after shrinkage

1.46 mm

Shrinkage temperature

+70…+120 °C

Gross weight

127.00

Transport packaging size/quantity

102*20*20/100

包装

in packs of 1 meter lengths

无铅代码

无

类型

Non-adhesive heat shrink tube

颜色

black

附加功能

LG-MAX

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

THROUGH-HOLE

峰值回流焊温度（摄氏度）

未说明

功能数量

4

端子间距

2.54 mm

Reach合规守则

unknown

时间@峰值回流温度-最大值(s)

未说明

引脚数量

14

JESD-30代码

R-GDIP-T14

电源电压-最大值(Vsup)

6 V

温度等级

MILITARY

电源电压-最小值(Vsup)

2 V

家人

HC/UH

输入数量

2

座位高度-最大

5.08 mm

Operating temperature range

-55…+125 °C

逻辑IC类型

NAND GATE

传播延迟(tpd)

135 ns

Shrinkage ratio

2 : 1

Operating voltage

600 V

长度

19.94 mm

宽度

7.62 mm