ROHM Semiconductor BU8768FV-E2

表面安装

YES

终端数量

16

RoHS

Non-Compliant

Package Description

TSSOP, TSSOP16,.25

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSSOP16,.25

Operating Temperature-Min

-20 °C

Supply Voltage-Nom

3 V

Operating Temperature-Max

70 °C

Rohs Code

有

Manufacturer Part Number

BU8768FV-E2

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

ROHM 半导体

Part Life Cycle Code

活跃

Ihs Manufacturer

ROHM CO LTD

Risk Rank

5.67

无铅代码

有

子类别

电话回路

端子位置

DUAL

终端形式

鸥翼

端子间距

0.635 mm

JESD-30代码

R-PDSO-G16

资历状况

不合格

电源

3 V

温度等级

COMMERCIAL

电源电流-最大值

2.5 mA

达到SVHC

compliant