ROHM Semiconductor MCR18EZHMJ3R3

触点镀层

Gold

外壳材料

Steel

Mounting Styles

板锁

Insert Arrangement

E09

Contact Materials

磷青铜

Manufacturer

TE Connectivity

Brand

TE Connectivity / AMP

Tradename

AMPLIMITE

Boardlocks

带板锁

RoHS

Details

Filtered

Unfiltered

Insulation Materials

Polybutylene Terephthalate

Shell Sizes

1 (E)

Maximum Operating Temperature

+ 125 C

Unit Weight

0.292880 oz

Minimum Operating Temperature

- 55 C

Factory Pack QuantityFactory Pack Quantity

100

Operating Temperature (Min)

-55 °C

Voltage, Rating

200 V

Operating Temperature (Max)

155 °C

包装

Bulk

系列

HD-20 Type B - Solder Terminal

容差

5 %

温度系数

400 ppm/°C

类型

Plug

电阻

3.3 Ω

定位的数量

9 Position

组成

厚膜

行数

2 Row

性别

Male

功率(瓦特)

250 mW

子类别

D-Sub Connectors

额定电流

2.2 A

螺距

2.74 mm

终端样式

通孔

触点性别

Without Pin Contacts

产品类别

D-Sub Connectors - Standard Density

外壳电镀

Tin

安装角

直角

产品类别

D-Sub Standard Connectors

高度

650 µm