ROHM Semiconductor ML927

表面安装

NO

终端数量

8

Package Description

DIP, DIP8,.3

Package Style

IN-LINE

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP8,.3

Operating Temperature-Min

-10 °C

Operating Temperature-Max

65 °C

Rohs Code

无

Manufacturer Part Number

ML927

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Dynex Semiconductor

Part Life Cycle Code

Obsolete

Ihs Manufacturer

GEC PLESSEY SEMICONDUCTORS

Risk Rank

5.79

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

其他电信集成电路

技术

MOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T8

资历状况

不合格

温度等级

COMMERCIAL

通信IC类型

电信电路