Samsung KMQE10013M-B318

表面安装

YES

终端数量

221

Package Description

BGA-221

Package Style

网格排列

Package Body Material

PLASTIC/EPOXY

Manufacturer Part Number

KMQE10013M-B318

Package Code

BGA

Package Shape

UNSPECIFIED

Manufacturer

三星半导体

Part Life Cycle Code

活跃

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Risk Rank

5.79

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

JESD-30代码

X-PBGA-B221

uPs/uCs/外围ICs类型

SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE

最大数据传输率

200 MBps

达到SVHC

compliant