Samsung Electro-Mechanics KLMBG8FE3B-A0010

表面安装

YES

终端数量

169

Manufacturer Part Number

KLMBG8FE3B-A0010

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Package Description

TFBGA,

Risk Rank

5.83

Operating Temperature-Max

85 °C

Operating Temperature-Min

-25 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TFBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Supply Voltage-Max

1.95 V

Supply Voltage-Nom

1.8 V

Supply Voltage-Min

1.7 V

附加功能

ALSO OPERATES AT 2.7 V MIN

端子位置

BOTTOM

终端形式

BALL

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B169

温度等级

OTHER

uPs/uCs/外围ICs类型

SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE

座位高度-最大

1.2 mm

外部数据总线宽度

8

主机数据传输速率-最大

44 MBps

主机接口标准

USB

长度

16 mm

宽度

12 mm