Samsung Semiconductor K9F2808U0C-YCB000

EU RoHS

不合规

ECCN (US)

3A991.b.1.a

Automotive

无

PPAP

无

Cell Type

SLC NAND

Chip Density (bit)

128M

Block Organization

Symmetrical

Address Bus Width (bit)

24

Number of Bits/Word (bit)

8

Number of Words

16M

Programmability

有

Timing Type

Asynchronous

Maximum Erase Time (S)

0.003/Block

Maximum Page Access Time (ns)

50(Min)

Maximum Programming Time (ms)

0.5/Chip

Interface Type

Parallel

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

20

Program Current (mA)

20

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

70

Supplier Temperature Grade

Commercial

Command Compatible

无

ECC Support

有

Support of Page Mode

有

Mounting

表面贴装

Package Height

1

Package Width

18.4

Package Length

12

PCB changed

48

Standard Package Name

SOP

Supplier Package

TSOP-I

Lead Shape

Gull-wing

包装

Tray

零件状态

Obsolete

引脚数量

48

建筑学

Sectored

行业规模

16Kbyte x 1024

页面尺寸

512byte

引导模块

无