Samsung Semiconductor K9F2G08U0A-PIB0000

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

HTS

8542.32.00.71

Automotive

无

PPAP

无

Cell Type

SLC NAND

Chip Density (bit)

2G

Block Organization

Symmetrical

Address Bus Width (bit)

29

Number of Bits/Word (bit)

8

Number of Words

256M

Programmability

有

Timing Type

Asynchronous

Maximum Erase Time (S)

0.002/Block

Maximum Page Access Time (ns)

25(Min)

Maximum Programming Time (ms)

0.7/Page

Interface Type

Parallel

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Page Read Current (mA)

30

Program Current (mA)

30

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

无

ECC Support

有

Support of Page Mode

有

Mounting

表面贴装

Package Height

1

Package Width

18.4

Package Length

12.4(Max)

PCB changed

48

Standard Package Name

SOP

Supplier Package

TSOP-I

Lead Shape

Gull-wing

零件状态

Obsolete

引脚数量

48

建筑学

Sectored

行业规模

128Kbyte x 2048

页面尺寸

2Kbyte

引导模块

无