Samsung Semiconductor K9F5608U0C-PIB000

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

Automotive

无

PPAP

无

Cell Type

SLC NAND

Chip Density (bit)

256M

Block Organization

Symmetrical

Address Bus Width (bit)

25

Number of Bits/Word (bit)

8

Number of Words

32M

Programmability

有

Timing Type

Asynchronous

Max. Access Time (ns)

10000

Maximum Erase Time (S)

0.003/Block

Maximum Page Access Time (ns)

50(Min)

Maximum Programming Time (ms)

0.5/Page

Interface Type

Parallel

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

20

Program Current (mA)

25

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

无

ECC Support

有

Support of Page Mode

有

Mounting

表面贴装

Package Height

1

Package Width

18.4

Package Length

12

PCB changed

48

Standard Package Name

SOP

Supplier Package

TSOP-I

Lead Shape

Gull-wing

零件状态

Unconfirmed

引脚数量

48

建筑学

Sectored

行业规模

16Kbyte x 2048

页面尺寸

512byte

引导模块

无