Samsung Semiconductor KAA00B606A-TGPX0

表面安装

YES

终端数量

127

Manufacturer Part Number

KAA00B606A-TGPX0

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Part Package Code

BGA

Package Description

LFBGA,

Risk Rank

5.84

Number of Words

16777216 words

Number of Words Code

16000000

Operating Temperature-Max

85 °C

Operating Temperature-Min

-25 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Supply Voltage-Nom (Vsup)

1.8 V

附加功能

SDRAM IS ORGANIZED AS 2M X 16 X 4 BANKS; UTRAM IS ORGANIZED AS 4M X 16

HTS代码

8542.32.00.71

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.8 mm

Reach合规守则

unknown

引脚数量

127

JESD-30代码

R-PBGA-B127

资历状况

不合格

电源电压-最大值(Vsup)

1.95 V

温度等级

OTHER

电源电压-最小值(Vsup)

1.65 V

操作模式

SYNCHRONOUS

组织结构

16MX16

座位高度-最大

1.4 mm

内存宽度

16

记忆密度

268435456 bit

内存IC类型

存储器电路

长度

12 mm

宽度

10.5 mm