Samsung Semiconductor KAB02D100M-TNGP

表面安装

YES

终端数量

80

Manufacturer Part Number

KAB02D100M-TNGP

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Package Description

FBGA, BGA80,8X13,32

Risk Rank

5.84

Access Time-Max

85 ns

Operating Temperature-Max

85 °C

Operating Temperature-Min

-25 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA80,8X13,32

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, FINE PITCH

Supply Voltage-Nom (Vsup)

3 V

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B80

资历状况

不合格

电源

3 V

温度等级

OTHER

电源电流-最大值

0.035 mA

待机电流-最大值

0.00001 A

内存IC类型

存储器电路

混合内存类型

FLASH+PSRAM