Samsung Semiconductor KLMCG4JENB-B0410

表面安装

YES

终端数量

153

Manufacturer Part Number

KLMCG4JENB-B0410

Part Life Cycle Code

活跃

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Package Description

VFBGA,

Risk Rank

5.79

Clock Frequency-Max (fCLK)

200 MHz

Number of Words

68719476736 words

Number of Words Code

64000000000

Operating Temperature-Max

85 °C

Operating Temperature-Min

-25 °C

Package Body Material

PLASTIC/EPOXY

Package Code

VFBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Supply Voltage-Nom (Vsup)

1.8 V

类型

MLC NAND TYPE

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B153

电源电压-最大值(Vsup)

1.95 V

温度等级

OTHER

电源电压-最小值(Vsup)

1.7 V

操作模式

SYNCHRONOUS

组织结构

64GX8

座位高度-最大

1 mm

内存宽度

8

记忆密度

549755813888 bit

并行/串行

PARALLEL

内存IC类型

FLASH

编程电压

1.8 V

长度

13 mm

宽度

11.5 mm