Samsung Semiconductor KS8809D

表面安装

YES

终端数量

16

Package Description

TSSOP, TSSOP16,.25

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSSOP16,.25

Operating Temperature-Min

-25 °C

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

KS8809D

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

三星半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Risk Rank

5.92

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

PLL或频率合成电路

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

端子间距

0.635 mm

Reach合规守则

compliant

JESD-30代码

R-PDSO-G16

资历状况

不合格

电源

1, 3 V

温度等级

OTHER