Samtec HCMP1802DX

表面安装

NO

终端数量

40

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

HCMP1802DX

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Hughes Microelectronics

Part Life Cycle Code

Obsolete

Ihs Manufacturer

HUGHES MICROELECTRONICS

Risk Rank

5.92

Operating Temperature-Min

-40 °C

Package Equivalence Code

DIP40,.6

Package Body Material

CERAMIC

Package Style

IN-LINE

Package Description

DIP, DIP40,.6

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Microprocessors

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T40

电源

5/10 V

温度等级

INDUSTRIAL

速度

3.2 MHz

uPs/uCs/外围ICs类型

MICROPROCESSOR, RISC

位元大小

8