SG Micro Corp SGM2564YG/TR

表面安装

YES

Contact plating

gold-plated

Number of pins

26

终端数量

6

Rohs Code

有

Part Life Cycle Code

接触制造商

Ihs Manufacturer

SG MICRO CORP

Package Description

WLCSP-6

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

VFBGA

Package Equivalence Code

BGA6,2X3,20

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Supply Voltage-Nom (Vsup)

1.1 V

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

2x13

Row pitch

2.54mm

Gross weight

1.4 g

Operating temperature

-40...163°C

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

260

功能数量

1

端子间距

0.5 mm

Reach合规守则

compliant

Current rating

3A

时间@峰值回流温度-最大值(s)

10

JESD-30代码

R-PBGA-B6

电源电压-最大值(Vsup)

5.5 V

电源电压-最小值(Vsup)

1 V

通道数量

1

模拟 IC - 其他类型

电源支持电路

可调阈值

NO

座位高度-最大

0.5 mm

Rated voltage

150V

个人资料

beryllium copper

长度

1.45 mm

宽度

0.95 mm

Plating thickness

0.75µm

Flammability rating

UL94V-0