SMC Corporation MDT10P55B2S

表面安装

YES

终端数量

14

Package Description

SOP, SOP14,.25

Package Style

小概要

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

SOP14,.25

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Manufacturer Part Number

MDT10P55B2S

RAM(byte)

72

Package Code

SOP

Package Shape

RECTANGULAR

Manufacturer

Micon Design Technology Corp

ROM(word)

1024

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICON DESIGN TECHNOLOGY CORP

Risk Rank

5.84

子类别

Microcontrollers

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

端子间距

1.27 mm

JESD-30代码

R-PDSO-G14

资历状况

不合格

电源

3/5 V

温度等级

INDUSTRIAL

速度

20 MHz

位元大小

8

只读存储器可编程性

UVPROM

达到SVHC

unknown