SMSC COM78C804

安装类型

Dual .25in Quick Connect w/Resistor

表面安装

NO

终端数量

40

Manufacturer

BARKER MICROFARADS INC

Package Description

DIP, DIP40,.6

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP40,.6

Supply Voltage-Nom

5 V

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

COM78C804

Package Code

DIP

Package Shape

RECTANGULAR

Part Life Cycle Code

Obsolete

Ihs Manufacturer

STANDARD MICROSYSTEMS CORP

Risk Rank

5.88

包装

Case Code - 4

尺寸/尺寸

1.812in W

容差

-0%/+20%

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

电容量

292uF

子类别

Serial IO/Communication Controllers

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T40

资历状况

不合格

电源

5 V

温度等级

COMMERCIAL

电压

125V

uPs/uCs/外围ICs类型

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

座位高度(最大)

4.365in