SMSC FDC37C75LJP

表面安装

YES

终端数量

68

Package Description

QCCJ, LDCC68,1.0SQ

Package Style

CHIP CARRIER

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

LDCC68,1.0SQ

Supply Voltage-Nom

5 V

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

FDC37C75LJP

Package Code

QCCJ

Package Shape

SQUARE

Manufacturer

Microchip Technology Inc

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROCHIP TECHNOLOGY INC

Risk Rank

5.88

子类别

辅助存储控制器

技术

CMOS

端子位置

QUAD

终端形式

J BEND

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

S-PQCC-J68

资历状况

不合格

电源

5 V

温度等级

COMMERCIAL