SMSC HDC9226

表面安装

NO

终端数量

24

RoHS

有

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP24,.6

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

HDC9226

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Microchip Technology Inc

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROCHIP TECHNOLOGY INC

Risk Rank

5.76

子类别

Drive Electronics

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T24

资历状况

不合格

温度等级

COMMERCIAL