Spansion MB90F997JBSPMC

表面安装

YES

终端数量

48

Package Description

LFQFP,

Package Style

FLATPACK, LOW PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

5 V

Supply Voltage-Min

3 V

Operating Temperature-Max

105 °C

Rohs Code

无

Manufacturer Part Number

MB90F997JBSPMC

Clock Frequency-Max

16 MHz

Package Code

LFQFP

Package Shape

SQUARE

Manufacturer

Spansion

ROM(word)

65536

Part Life Cycle Code

Transferred

Number of I/O Lines

36

Ihs Manufacturer

SPANSION INC

Supply Voltage-Max

5.5 V

Risk Rank

5.56

技术

CMOS

端子位置

QUAD

终端形式

鸥翼

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

S-PQFP-G48

温度等级

INDUSTRIAL

速度

32 MHz

uPs/uCs/外围ICs类型

MICROCONTROLLER

位元大小

16

有ADC

YES

DMA 通道

YES

脉宽调制通道

NO

数模转换器通道

YES

座位高度-最大

1.7 mm

只读存储器可编程性

FLASH

宽度

7 mm

长度

7 mm