STMicroelectronics HCC4002BK

表面安装

YES

终端数量

14

Package Description

DFP, FL14,.3

Package Style

FLATPACK

Package Body Material

CERAMIC

Package Equivalence Code

FL14,.3

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

HCC4002BK

Package Code

DFP

Package Shape

RECTANGULAR

Manufacturer

SGS-Ates Componenti Electronici SPA

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SGS-ATES COMPONENTI ELECTRONICI S P A

Risk Rank

5.92

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Gates

技术

CMOS

端子位置

DUAL

终端形式

FLAT

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

R-XDFP-F14

资历状况

不合格

电源

5/15 V

温度等级

MILITARY

逻辑IC类型

NOR GATE

施密特触发器

NO