STMicroelectronics HCF40107BE

表面安装

NO

终端数量

8

RoHS

Non-Compliant

Package Style

IN-LINE

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP8,.3

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

HCF40107BE

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

STMicroelectronics

Part Life Cycle Code

Obsolete

Ihs Manufacturer

STMICROELECTRONICS

Risk Rank

5.85

Prop.

200 ns

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Gates

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

not_compliant

JESD-30代码

R-PDIP-T8

资历状况

不合格

电源

3/15 V

温度等级

INDUSTRIAL

输出特性

OPEN-DRAIN

逻辑IC类型

NAND GATE

施密特触发器

NO