STMicroelectronics HCF4023BEY

底架

通孔

引脚数

14

Number of Element Outputs

1

Number of Selection Inputs per Element

0

Number of Output Enables per Element

0

Number of Element Inputs

3-IN

Number of Elements per Chip

3

Logic Family

4000B

ECCN (US)

EAR99

Lead Shape

通孔

PCB changed

14

Package Width

7.1(Max)

Package Length

20(Max)

Package Height

5.1(Max) - 0.51(Min)

Mounting

通孔

Supplier Package

PDIP

Standard Package Name

DIP

Maximum Operating Temperature (°C)

125

Minimum Operating Temperature (°C)

-55

Propagation Delay Test Condition (pF)

50

Maximum Quiescent Current (uA)

5

Typical Quiescent Current (uA)

0.02

Maximum Operating Supply Voltage (V)

20

Typical Operating Supply Voltage (V)

18|9|5|12|15|3.3

Minimum Operating Supply Voltage (V)

3

Maximum High Level Output Current (mA)

-2.4(Min)

Maximum Low Level Output Current (mA)

2.4(Min)

Process Technology

CMOS

Absolute Propagation Delay Time (ns)

250

Maximum Propagation Delay Time @ Maximum CL (ns)

120@10V|250@5V|90@15V

Number of Elements

3

RoHS

Non-Compliant

Package Description

DIP, DIP14,.3

Rohs Code

无

Manufacturer Part Number

HCF4023BEY

Manufacturer

STMicroelectronics

Part Life Cycle Code

活跃

Ihs Manufacturer

STMICROELECTRONICS

Risk Rank

5.21

Part Package Code

DIP

包装

Tube

无铅代码

无

零件状态

Obsolete

最高工作温度

125 °C

最小工作温度

-55 °C

HTS代码

8542.39.00.01

Reach合规守则

not_compliant

输出的数量

1

最大电源电压

20 V

最小电源电压

3 V

传播延迟

250 ns

静态电流

5 µA

逻辑功能

NAND

阀门数量

3

高电平输出电流

-2.4 mA

低水平输出电流

2.4 mA

输入行数

3

输出行数

1

RoHS状态

供应商未确认