STMicroelectronics LSM330D

表面安装

YES

终端数量

28

Package Description

VFLGA,

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Manufacturer Part Number

LSM330D

Supply Voltage-Nom (Vsup)

3 V

Package Code

VFLGA

Package Shape

RECTANGULAR

Manufacturer

STMicroelectronics

Part Life Cycle Code

Obsolete

Ihs Manufacturer

STMICROELECTRONICS

Risk Rank

5.82

ECCN 代码

EAR99

HTS代码

8542.39.00.01

技术

CMOS

端子位置

BOTTOM

终端形式

BUTT

功能数量

1

端子间距

0.45 mm

Reach合规守则

unknown

JESD-30代码

R-PBGA-B28

Brand Name

STMicroelectronics

电源电压-最大值(Vsup)

3.6 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

2.4 V

模拟 IC - 其他类型

模拟电路

座位高度-最大

1 mm

宽度

3 mm

长度

5.5 mm