STMicroelectronics M27256-25F1

表面安装

NO

终端数量

28

RoHS

Non-Compliant

Package Description

DIP, DIP28,.6

Package Style

IN-LINE

Number of Words Code

32000

Package Body Material

CERAMIC

Package Equivalence Code

DIP28,.6

Access Time-Max

250 ns

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

M27256-25F1

Number of Words

32768 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

SGS-Ates Componenti Electronici SPA

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SGS-ATES COMPONENTI ELECTRONICI S P A

Risk Rank

5.91

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

EPROMs

技术

MOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T28

资历状况

不合格

电源

5 V

温度等级

COMMERCIAL

电源电流-最大值

0.1 mA

组织结构

32KX8

输出特性

3-STATE

内存宽度

8

记忆密度

262144 bit

I/O类型

COMMON

编程电压

12.5 V