STMicroelectronics M72DW64000B70Z

表面安装

YES

终端数量

73

Package Style

GRID ARRAY, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA73,10X12,32

Operating Temperature-Min

-30 °C

Access Time-Max

70 ns

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

M72DW64000B70Z

Package Code

FBGA

Package Shape

RECTANGULAR

Manufacturer

STMicroelectronics

Part Life Cycle Code

Obsolete

Ihs Manufacturer

STMICROELECTRONICS

Risk Rank

5.84

子类别

其他存储器集成电路

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

unknown

JESD-30代码

R-PBGA-B73

资历状况

不合格

电源

3,3/3.3 V

温度等级

OTHER

电源电流-最大值

0.02 mA

待机电流-最大值

0.0015 A

内存IC类型

存储器电路

混合内存类型

FLASH+PSRAM