STMicroelectronics M74HC266B1

表面安装

NO

终端数量

14

RoHS

Non-Compliant

Package Style

IN-LINE

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP14,.3

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

M74HC266B1

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

STMicroelectronics

Part Life Cycle Code

活跃

Ihs Manufacturer

STMICROELECTRONICS

Risk Rank

2.55

Prop.

26 ns

子类别

Gates

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

not_compliant

JESD-30代码

R-PDIP-T14

资历状况

不合格

电源

2/6 V

温度等级

INDUSTRIAL

逻辑IC类型

XNOR门

最大 I(ol)

0.004 A

施密特触发器

NO