STMicroelectronics NE558N

表面安装

NO

终端数量

16

Ihs Manufacturer

飞利浦半导体

Manufacturer

Philips Semiconductors

Manufacturer Part Number

NE558N

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

DIP

Package Description

DIP, DIP16,.3

Package Equivalence Code

DIP16,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Part Life Cycle Code

Transferred

Risk Rank

8.7

Rohs Code

无

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

模拟波形生成功能

技术

BIPOLAR

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T16

资历状况

不合格

电源

5/15 V

温度等级

COMMERCIAL