STMicroelectronics PBL3726/11

表面安装

NO

终端数量

18

Package Style

IN-LINE

Package Shape

RECTANGULAR

Package Equivalence Code

DIP18,.3

Package Code

DIP

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Operating Temperature-Max

70 °C

Ihs Manufacturer

STMICROELECTRONICS

Part Life Cycle Code

Obsolete

Rohs Code

无

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

not_compliant

JESD-30代码

R-PDIP-T18

资历状况

不合格

温度等级

OTHER

电源电流-最大值

100 mA