STMicroelectronics WS57C256F-55DM

表面安装

NO

终端数量

28

Package Description

0.600 INCH, CERAMIC, DIP-28

Package Style

IN-LINE

Number of Words Code

32000

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Operating Temperature-Min

-55 °C

Access Time-Max

55 ns

Operating Temperature-Max

125 °C

Manufacturer Part Number

WS57C256F-55DM

Number of Words

32768 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

e2v technologies

Part Life Cycle Code

活跃

Ihs Manufacturer

TELEDYNE E2V (UK) LTD

Risk Rank

5.08

Part Package Code

DIP

ECCN 代码

EAR99

HTS代码

8542.32.00.61

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

Reach合规守则

compliant

引脚数量

28

JESD-30代码

R-CDIP-T28

资历状况

不合格

电源电压-最大值(Vsup)

5.5 V

温度等级

MILITARY

电源电压-最小值(Vsup)

4.5 V

操作模式

ASYNCHRONOUS

组织结构

32KX8

内存宽度

8

记忆密度

262144 bit

并行/串行

PARALLEL

内存IC类型

UVPROM