STMicroelectronics WS57C291C-25S

表面安装

NO

终端数量

24

Package Description

0.300 INCH, PLASTIC, DIP-24

Package Style

IN-LINE

Number of Words Code

2000

Package Body Material

PLASTIC/EPOXY

Access Time-Max

25 ns

Operating Temperature-Max

70 °C

Manufacturer Part Number

WS57C291C-25S

Number of Words

2048 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

e2v technologies

Part Life Cycle Code

活跃

Ihs Manufacturer

TELEDYNE E2V (UK) LTD

Risk Rank

5.31

Part Package Code

DIP

ECCN 代码

EAR99

HTS代码

8542.32.00.61

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

Reach合规守则

compliant

引脚数量

24

JESD-30代码

R-PDIP-T24

电源电压-最大值(Vsup)

5.5 V

温度等级

COMMERCIAL

电源电压-最小值(Vsup)

4.5 V

操作模式

ASYNCHRONOUS

组织结构

2KX8

内存宽度

8

记忆密度

16384 bit

并行/串行

PARALLEL

内存IC类型

UVPROM