Taiwan Semiconductor BZY55B30 RBG

包装/外壳

0805 (2012 metric)

RoHS

Details

Mounting Styles

SMD/SMT

Vz - Zener Voltage

30 V

Pd - Power Dissipation

500 mW

Zz - Zener Impedance

80 Ohms

Minimum Operating Temperature

- 55 C

If - Forward Current

10 mA

Maximum Operating Temperature

+ 150 C

Ir - Maximum Reverse Leakage Current

0.1 uA

Ir - Reverse Current

0.1 uA

Factory Pack QuantityFactory Pack Quantity

10000

Part # Aliases

BZY55B30

Unit Weight

0.000212 oz

Moisture Sensitivity Levels

1

Reflow Temperature-Max (s)

未说明

Rohs Code

有

Manufacturer Part Number

BZY55B30RBG

Part Life Cycle Code

活跃

Ihs Manufacturer

TAIWAN SEMICONDUCTOR CO LTD

Risk Rank

5.47

系列

BZY55B30

包装

切割胶带

JESD-609代码

e3

ECCN 代码

EAR99

端子表面处理

Matte Tin (Sn)

HTS代码

8541.10.00.50

峰值回流焊温度（摄氏度）

未说明

Reach合规守则

compliant

配置

Single

测试电流

5 mA

电压允差

2 %

齐纳电流

5 mA

Vf-正向电压

1.5 V

高度

0.85 mm

长度

2.2 mm

宽度

1.45 mm