Taiwan Semiconductor GBPC25005 T0

表面安装

NO

二极管元件材料

SILICON

终端数量

4

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

150

Standard Package Name

Module

Supplier Package

GBPC型壳体

Military

无

Mounting

Screw

Package Height

11.23(Max)

PCB changed

4

Package Width

29(Max)

Package Length

29(Max)

Peak Reverse Current (uA)

5

Peak Forward Voltage (V)

[email protected]

Peak Non-Repetitive Forward Surge Current (A)

300

Peak RMS Reverse Voltage (V)

35

Peak Average Forward Current (A)

25

Peak Reverse Repetitive Voltage (V)

50

Bridge Type

单相

HTS

8541.10.00.80

ECCN (US)

EAR99

Package Description

S-PUFM-D4

Package Style

FLANGE MOUNT

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-55 °C

Reflow Temperature-Max (s)

未说明

Operating Temperature-Max

150 °C

Rohs Code

有

Manufacturer Part Number

GBPC25-005T0

Package Shape

SQUARE

Manufacturer

台湾半导体

Number of Elements

4

Part Life Cycle Code

活跃

Ihs Manufacturer

TAIWAN SEMICONDUCTOR CO LTD

Risk Rank

5.1

JESD-609代码

e3

零件状态

活跃

ECCN 代码

EAR99

端子表面处理

哑光锡

附加功能

UL 认证

HTS代码

8541.10.00.80

端子位置

UPPER

终端形式

SOLDER LUG

峰值回流焊温度（摄氏度）

未说明

Reach合规守则

compliant

引脚数量

4

JESD-30代码

S-PUFM-D4

配置

Single

二极管类型

桥式整流二极管

输出电流-最大值

25 A

相位的数量

1

Rep Pk反向电压-最大值

50 V

最大非代表Pk前进电流

300 A

击穿电压-最小值

50 V

RoHS状态

是,有豁免