Taiwan Semiconductor HS1GL R2G

表面安装

YES

二极管元件材料

SILICON

终端数量

2

ECCN (US)

EAR99

Maximum DC Reverse Voltage (V)

400

Peak Reverse Repetitive Voltage (V)

400

Maximum Continuous Forward Current (A)

1

Peak Non-Repetitive Surge Current (A)

30

Peak Forward Voltage (V)

1.3

Peak Reverse Current (uA)

5

Peak Reverse Recovery Time (ns)

50

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

150

Automotive

有

AEC Qualified Number

AEC-Q101

Supplier Package

Sub SMA

Military

无

Mounting

表面贴装

Package Height

1.33(Max)

Package Length

2.9(Max)

Package Width

1.9(Max)

PCB changed

2

Lead Shape

Flat

Package Description

R-PDSO-F2

Package Style

小概要

Moisture Sensitivity Levels

1

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-55 °C

Reflow Temperature-Max (s)

30

Operating Temperature-Max

150 °C

Rohs Code

有

Manufacturer Part Number

HS1GLR2G

Package Shape

RECTANGULAR

Manufacturer

台湾半导体

Number of Elements

1

Part Life Cycle Code

活跃

Ihs Manufacturer

TAIWAN SEMICONDUCTOR CO LTD

Risk Rank

5.56

包装

卷带

JESD-609代码

e3

零件状态

活跃

ECCN 代码

EAR99

类型

开关二极管

端子表面处理

Matte Tin (Sn)

附加功能

低功率损耗

端子位置

DUAL

终端形式

FLAT

峰值回流焊温度（摄氏度）

260

Reach合规守则

compliant

引脚数量

2

JESD-30代码

R-PDSO-F2

配置

Single

二极管类型

接收电极

输出电流-最大值

1 A

Rep Pk反向电压-最大值

400 V

反向恢复时间-最大值

0.05 µs

RoHS状态

是,有豁免