TDK 73M223-CP

表面安装

NO

终端数量

16

Manufacturer Part Number

73M223-CP

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SILICON SYSTEMS INC

Package Description

,

Risk Rank

5.82

Operating Temperature-Max

70 °C

Operating Temperature-Min

-25 °C

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom

12 V

附加功能

HALF DUPLEX

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

Reach合规守则

unknown

JESD-30代码

R-PDIP-T16

资历状况

不合格

温度等级

OTHER

数据率

1.2 Mbps

通信IC类型

MODEM