C1608X5R1C225M详情
TDK C1608X5R1C225M重要参数规格及、参数值,及相似型号如下:
- 参数名参数值全选
- 参数名参数值全选
包装/外壳
0603
介电材料
X5R
终端数量
2
ECCN (US)
EAR99
HTS
8532.24.00.20
Capacitance Value
2.2uF
Voltage - Rated
16VDC
Equivalent Series Resistance Type
Low
Microwave Application
有
Mounting
表面贴装
Case Style
陶瓷芯片
Dissipation Factor (%)
10
Minimum Operating Temperature (°C)
-55
Maximum Operating Temperature (°C)
85
Product Depth (mm)
0.8
Wire Form
不需要
Operating Temp Range
-55C to 85C
Product Diameter (mm)
Not Required(mm)
Mounting Styles
表面贴装
Temp Coeff (Dielectric)
X5R
Lead Diameter (nom)
Not Required(mm)
Tolerance (+ or -)
20%
Rad Hardened
无
Seated Plane Height
Not Required(mm)
Operating Temperature (Min)
-55 °C
Voltage, Rating
16 V
Voltage Rating (DC)
16 V
Operating Temperature (Max)
85 °C
RoHS
Compliant
包装
卷带
容差
20%
零件状态
NRND
终端
SMD/SMT
组成
Ceramic
电容量
2200000(pF)
结构
Flat
终端样式
Pad
箱码(公制)
1608
箱码(英制)
0603
失败率
不需要
尺寸(mm)
1.6 X 0.8 X 0.8
产品长度(mm)
1.6
宽度
800 µm
长度
1.6 mm
产品高度(mm)
0.8
RoHS状态
符合RoHS标准
C1608X5R1C225M拓展信息
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